Microfracture in high temperature metal matrix crossply laminates

Microfracture (fiber/matrix fracture, interphase debonding, and inter-ply delamination) in high temperature metal matrix composites (HTMMC), subjected to both mechanical and thermal loading, is computationally simulated. A crossply 0.3 fiber volume ratio SiC/Ti15 composite with 0/90/0 lay-up is evaluated for microfracture using a multicell finite element model. A computational simulation procedure based on strain energy release rates is used to predict the fracture process and establish the hierarchy of fracture modes. Microfracture results for various loading cases are presented and discussed.