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Creep and fracture of dispersion-strengthened materialsThe creep and fracture of dispersion strengthened materials is reviewed. A compilation of creep data on several alloys showed that the reported values of the stress exponent for creep varied between 3.5 and 100. The activation energy for creep exceeded that for lattice self diffusion in the matrix in the case of some materials and a threshold stress behavior was generally reported in these instances. The threshold stress is shown to be dependent on the interparticle spacing and it is significantly affected by the initial microstructure. The effect of particle size and the nature of the dispersoid on the threshold stress is not well understood at the present time. In general, most studies indicate that the microstructure after creep is similar to that before testing and very few dislocations are usually observed. It is shown that the stress acting on a dispersoid due to a rapidly moving dislocation can exceed the particle yield strength of the G sub p/1000, where G sub p is the shear modulus of the dispersoid. The case when the particle deforms is examined and it is suggested that the dislocation creep threshold stress of the alloy is equal to the yield strength of the dispersoid under these conditions. These results indicate that the possibility that the dispersoid creep threshold stress is determined by either the particle yield strength or the stress required to detach a dislocation from the dispersoid matrix interface. The conditions under which the threshold stress is influenced by one or the other mechanism are discussed and it is shown that the particle yield strength is important until the extent of dislocation core relaxation at the dispersoid matrix interface exceeds about 25 pct. depending on the nature of the particle matrix combination. Finally, the effect of grain boundaries and grain morphology on the creep and fracture behavior of dispersoid strengthened alloys is examined.
Document ID
19910017910
Acquisition Source
Legacy CDMS
Document Type
Preprint (Draft being sent to journal)
Authors
Raj, Sai V.
(Cleveland State Univ. OH, United States)
Date Acquired
September 6, 2013
Publication Date
June 1, 1991
Subject Category
Composite Materials
Report/Patent Number
NASA-CR-185299
NAS 1.26:185299
E-3612
Report Number: NASA-CR-185299
Report Number: NAS 1.26:185299
Report Number: E-3612
Accession Number
91N27224
Funding Number(s)
PROJECT: RTOP 505-63-01
CONTRACT_GRANT: NCC3-72
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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