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Thermal conductance of two interface materials and their applications in space systemsThe temperature control of spacecraft and instrument systems and subsystems requires heat transfer interface materials that possess good thermal and structural characteristics, among other properties, to respond to the vacuum environment of space. These materials must be easy to apply to, and remove from, the surfaces where they are applied, and must be able to withstand power dissipation extremes, and be used for different clamping configurations and pressures. Silicone based greases, used in the past, tend to migrate and to contaminate nearby surfaces. Bare metal to metal contact offers low thermal conductance and difficulties in estimating the actual heat transfer. Several polymeric materials containing different thermal conductive compounds and structural reinforcements were prepared to overcome grease and metal problems. Two polymeric materials were evaluated: Cho-Therm 1671 elastomer; and the CV-2946, a conductive RTV silicone. Tests were done to learn more about these products. Results indicate that the tightly bolted, torqued fixtures did not buckle or distort, and provided optimum thermal conductance. Fixtures simulating actual spacecraft configuration suffered bowing and separating.
Document ID
19920010792
Acquisition Source
Legacy CDMS
Document Type
Technical Memorandum (TM)
Authors
Scialdone, J. J.
(NASA Goddard Space Flight Center Greenbelt, MD, United States)
Clatterbuck, C. H.
(NASA Goddard Space Flight Center Greenbelt, MD, United States)
Wall, J. L.
(NASA Goddard Space Flight Center Greenbelt, MD, United States)
Date Acquired
September 6, 2013
Publication Date
March 1, 1992
Subject Category
Nonmetallic Materials
Report/Patent Number
NASA-TM-104554
REPT-92B00012
NAS 1.15:104554
Report Number: NASA-TM-104554
Report Number: REPT-92B00012
Report Number: NAS 1.15:104554
Accession Number
92N20034
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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