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High temperature dielectric properties of Apical, Kapton, Peek, Teflon AF, and Upilex polymersReliable lightweight systems capable of providing electrical power at the magawatt level are a requirement for future manned space exploration missions. This can be achieved by the development of high temperature insulating materials which are not only capable of surviving the hostile space environment but can contribute to reducing the mass and weight of the heat rejection system. In this work, Apical, Upilex, Kapton, Teflon AF, and Peek polymers are characterized for AC and DC dielectric breakdown in air and in silicone oil at temperatures up to 250 C. The materials are also tested in terms of their dielectric constant and dissipation factor at high temperatures with an electrical stress of 60 Hz, 200 V/mil present. The effects of thermal aging on the properties of the films are determined after 15 hours of exposure to 200 and 250 C, each. The results obtained are discussed and conclusions are made concerning the suitability of these dielectrics for use in capacitors and cable insulations in high temperature environments.
Document ID
19920019432
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Hammoud, A. N.
(Sverdrup Technology, Inc., Brook Park OH., United States)
Baumann, E. D.
(State Univ. of New York Buffalo., United States)
Overton, E.
(State Univ. of New York Buffalo., United States)
Myers, I. T.
(NASA Lewis Research Center Cleveland, OH, United States)
Suthar, J. L.
(State Univ. of New York Buffalo., United States)
Khachen, W.
(State Univ. of New York Buffalo., United States)
Laghari, J. R.
(State Univ. of New York Buffalo., United States)
Date Acquired
September 6, 2013
Publication Date
January 1, 1992
Subject Category
Electronics And Electrical Engineering
Report/Patent Number
E-7161
NASA-TM-105753
NAS 1.15:105753
Report Number: E-7161
Report Number: NASA-TM-105753
Report Number: NAS 1.15:105753
Meeting Information
Meeting: 1992 Conference on Electrical Insulation and Dielectric Phenomena
Location: Victoria, British Columbia
Country: Canada
Start Date: October 18, 1992
End Date: October 21, 1992
Sponsors: IEEE
Accession Number
92N28675
Funding Number(s)
PROJECT: RTOP 506-41-41
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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