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High temperature solder device for flat cablesA high temperature solder device for flat cables includes a microwelder, an anvil which acts as a heat sink and supports a flexible flat ribbon cable that is to be connected to a multiple pin connector. The microwelder is made from a modified commercially available resistance welding machine such as the Split Tip Electrode microwelder by Weltek, which consists of two separate electrode halves with a removable dielectric spacer in between. The microwelder is not used to weld the items together, but to provide a controlled compressive force on, and energy pulse to, a solder preform placed between a pin of the connector and a conductor of the flexible flat ribbon cable. When the microwelder is operated, an electric pulse will flow down one electrode, through the solder preform and back up the other electrode. This pulse of electrical energy will cause the solder preform to heat up and melt, joining the pin and conductor.
Document ID
19920019851
Acquisition Source
Legacy CDMS
Document Type
Other - Patent
Authors
Haehner, Carl L.
(NASA Goddard Space Flight Center Greenbelt, MD, United States)
Date Acquired
August 15, 2013
Publication Date
June 30, 1992
Subject Category
Metallic Materials
Report/Patent Number
Patent Number: NASA-CASE-GSC-13344-1
Patent Application Number: US-PATENT-APPL-SN-718046
Patent Number: US-PATENT-5,126,527
Accession Number
92N29094
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
NASA-CASE-GSC-13344-1|US-PATENT-5,126,527
Patent Application
US-PATENT-APPL-SN-718046
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