Method and apparatus for deflection measurements using eddy current effects

A method and apparatus for inserting and moving a sensing assembly with a mechanical positioning assembly to a desired remote location of a surface of a specimen under test and measuring angle and/or deflection by sensing the change in the impedance of at least one sensor coil located in a base plate which has a rotatable conductive plate pivotally mounted thereon so as to uncover the sensor coil(s) whose impedance changes as a function of deflection away from the center line of the base plate in response to the movement of the rotator plate when contacting the surface of the specimen under test is presented. The apparatus includes the combination of a system controller, a sensing assembly, an eddy current impedance measuring apparatus, and a mechanical positioning assembly driven by the impedance measuring apparatus to position the sensing assembly at a desired location of the specimen.