Insoluble, Low-Dielectric-Constant Polyimides

In process, insoluble, low-dielectric-constant polyimides produced by combining dianhydride of bis{4-(3,4-dicarboxyphenoxy) phenyl}perfluoroisopropylidene (BFDA) with fluorinated aromatic diamine; each molecule contains at least one or more CF3 groups. These fully fluorinated polyimides have dielectric constants in range of 2.4 to 2.5 at 10 GHz. Suitable for use as composite matrix resins in advanced aerospace applications. Potential use in microelectronics industry, particularly as insulating resins in production of printed-circuit boards.