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Polyimide processing additivesA process for preparing polyimides having enhanced melt flow properties is described. The process consists of heating a mixture of a high molecular weight poly-(amic acid) or polyimide with a low molecular weight amic acid or imide additive in the range of 0.05 to 15 percent by weight of the additive. The polyimide powders so obtained show improved processability, as evidenced by lower melt viscosity by capillary rheometry. Likewise, films prepared from mixtures of polymers with additives show improved processability with earlier onset of stretching by TMA.
Document ID
19940018606
Acquisition Source
Legacy CDMS
Document Type
Other - Patent
Authors
Pratt, J. Richard
(NASA Langley Research Center Hampton, VA, United States)
St.clair, Terry L.
(NASA Langley Research Center Hampton, VA, United States)
Stoakley, Diane M.
(NASA Langley Research Center Hampton, VA, United States)
Burks, Harold D.
(NASA Langley Research Center Hampton, VA, United States)
Date Acquired
August 16, 2013
Publication Date
December 21, 1993
Subject Category
Nonmetallic Materials
Report/Patent Number
Patent Number: US-PATENT-5,272,248
Patent Application Number: US-PATENT-APPL-SN-892058
Patent Number: NASA-CASE-LAR-13669-2
Patent Application Number: US-PATENT-APPL-SN-084064
Accession Number
94N23079
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
US-PATENT-5,272,248|NASA-CASE-LAR-13669-2
Patent Application
US-PATENT-APPL-SN-892058|US-PATENT-APPL-SN-084064
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