Plasma treatment of polymer dielectric films to improve capacitive energy storage

Demand for compact instrumentation, portable field equipment, and new electromagnetic weapons is creating a need for new dielectric materials with higher energy storage capabilities. Recognizing the need for higher energy storage capacitors, the Army Research Lab at Fort Monmouth, NJ, initiated a program a year ago to investigate potential methods for increasing the dielectric strength of polyvinylidene difluoride (PVDF) film, which is the highest energy density material commercially available today. Treatment of small area PVDF films in a CF4/O2 plasma showed that the dielectric strength of PVDF films can be increased by as much as 20 percent when treated in a 96 percent CF4/4 percent O2 plasma. This 44 percent increase in energy storage of a PVDF capacitor is significant considering that the treatment can be implemented in a conventional metallizing chamber, with minimum capital investment. The data shows that improved breakdown strength may be unique to PVDF film and the particular CF4/O2 gas mixture, because PVDF film treated with 100 percent CF4, 100 percent O2, Ar gas plasma, and electron irradiation shows no improvement in breakdown strength. Other data presented includes dissipation factor, dielectric constant, and surface tension measurements.