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Low pressure process for continuous fiber reinforced polyamic acid resin matrix composite laminatesA low pressure processor was developed for preparing a well-consolidated polyimide composite laminate. Prepreg plies were formed from unidirectional fibers and a polyamic acid resin solution. Molding stops were placed at the sides of a matched metal die mold. The prepreg plies were cut shorter than the length of the mold in the in-plane lateral direction and were stacked between the molding stops to a height which was higher than the molding stops. The plies were then compressed to the height of the stops and heated to allow the volatiles to escape and to start the imidization reaction. After removing the stops from the mold, the heat was increased and 0 - 500 psi was applied to complete the imidization reaction. The heat and pressure were further increased to form a consolidated polyimide composite laminate.
Document ID
19940030569
Acquisition Source
Legacy CDMS
Document Type
Other - Patent
Authors
Druyun, Darleen A.
(NASA Langley Research Center Hampton, VA, United States)
Hou, Tan-Hung
(NASA Langley Research Center Hampton, VA, United States)
Kidder, Paul W.
(NASA Langley Research Center Hampton, VA, United States)
Reddy, Rakasi M.
(NASA Langley Research Center Hampton, VA, United States)
Baucom, Robert M.
(NASA Langley Research Center Hampton, VA, United States)
Date Acquired
August 16, 2013
Publication Date
May 17, 1994
Subject Category
Composite Materials
Report/Patent Number
Patent Application Number: US-PATENT-APPL-SN-924689
Patent Number: NASA-CASE-LAR-14954-1
Patent Number: US-PATENT-5,312,579
Accession Number
94N35075
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
NASA-CASE-LAR-14954-1|US-PATENT-5,312,579
Patent Application
US-PATENT-APPL-SN-924689
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