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Tough, processable semi-interpenetrating polymer networks from monomer reactantsA high temperature semi-interpenetrating polymer network (semi-IPN) was developed which had significantly improved processability, damage tolerance, and mechanical performance, when compared to the commercial Thermid materials. This simultaneous semi-IPN was prepared by mixing the monomer precursors of Thermid AL-600 (a thermoset) and NR-150B2 (a thermoplastic) and allowing the monomers to react randomly upon heating. This reaction occurs at a rate which decreases the flow and broadens the processing window. Upon heating at a higher temperature, there is an increase in flow. Because of the improved flow properties, broadened processing window and enhanced toughness, high strength polymer matrix composites, adhesives and molded articles can now be prepared from the acetylene end-capped polyimides which were previously inherently brittle and difficult to process.
Document ID
19940030727
Acquisition Source
Legacy CDMS
Document Type
Other - Patent
Authors
Pater, Ruth H.
(NASA Langley Research Center Hampton, VA, United States)
Date Acquired
August 16, 2013
Publication Date
April 26, 1994
Subject Category
Nonmetallic Materials
Report/Patent Number
Patent Number: NASA-CASE-LAR-14838-1
Patent Number: US-PATENT-5,306,784
Patent Application Number: US-PATENT-APPL-SN-430470
Patent Application Number: US-PATENT-APPL-SN-831763
Accession Number
94N35233
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
NASA-CASE-LAR-14838-1|US-PATENT-5,306,784
Patent Application
US-PATENT-APPL-SN-430470|US-PATENT-APPL-SN-831763
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