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Electrically conductive, thermally insulating cryogenic current leadsAn electrically conductive, thermally insulating current lead assembly has been developed for cryogenic systems. This lead assembly consists of thick film elements of high temperature superconductive materials deposited onto a low thermal conductivity substrate. The superconductor elements provide current transport but minimize heat transfer. The substrate provides the mechanical durability necessary for cryogenic and other environments.
Document ID
19940032274
Acquisition Source
Headquarters
Document Type
Other - Patent Application
Authors
Wise, Stephanie A.
(NASA Langley Research Center Hampton, VA, United States)
Hooker, Matthew W.
(NASA Langley Research Center Hampton, VA, United States)
Date Acquired
August 16, 2013
Publication Date
March 15, 1994
Subject Category
Electronics And Electrical Engineering
Report/Patent Number
NAS 1.71:LAR-14964-1-CU
Report Number: NAS 1.71:LAR-14964-1-CU
Patent Application Number: US-PATENT-APPL-SN-215793
Patent Number: NASA-CASE-LAR-14964-1-CU
Accession Number
94N36781
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
NASA-CASE-LAR-14964-1-CU
Patent Application
US-PATENT-APPL-SN-215793
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