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Microelectronics in JapanThe purpose of this JTEC study is to evaluate Japan's electronic manufacturing and packaging capabilities within the context of global economic competition. To carry out this study, the JTEC panel evaluated the framework of the Japanese consumer electronics industry and various technological and organizational factors that are likely to determine who will win and lose in the marketplace. This study begins with a brief overview of the electronics industry, especially as it operates in Japan today. Succeeding chapters examine the electronics infrastructure in Japan and take an in-depth look at the central issues of product development in order to identify those parameters that will determine future directions for electronic packaging technologies.
Document ID
19950020807
Acquisition Source
Legacy CDMS
Document Type
Other
Authors
Boulton, William R.
(Auburn Univ. AL., United States)
Date Acquired
August 16, 2013
Publication Date
February 1, 1995
Publication Information
Publication: JTEC Panel Report on Electronic Manufacturing and Packaging in Japan
Subject Category
Electronics And Electrical Engineering
Accession Number
95N27227
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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