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Features and applications of the Groove Analysis Program (GAP)An IBM Personal Computer (PC) version of the Groove Analysis program (GAP) was developed to predict the steady state heat transport capability of an axially grooved heat pipe for a specified groove geometry and working fluid. In the model, the capillary limit is determined by the numerical solution of the differential equation for momentum conservation with the appropriate boundary conditions. This governing equation accounts for the hydrodynamic losses due to friction in liquid and vapor flows and due to liquid/vapor shear interaction. Back-pumping in both 0-g and 1-g is accounted for in the boundary condition at the condenser end. Slug formation in 0-g and puddle flow in 1-g are also considered in the model. At the user's discretion, the code will perform the analysis for various fluid inventories (undercharge, nominal charge, overcharge, or a fixed fluid charge) and heat pipe elevations. GAP will also calculate the minimum required heat pipe wall thickness for pressure containment at design temperatures that are greater than or lower than the critical temperature of the working fluid. This paper discusses the theory behind the development of the GAP model. It also presents the many useful and powerful capabilities of the model. Furthermore, a correlation of flight test performance data and the predictions using GAP are presented and discussed.
Document ID
19950020928
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Ku, Jentung
(NASA Goddard Space Flight Center Greenbelt, MD, United States)
Nguyen, Tu M.
(OAO Corp. Greenbelt, MD., United States)
Brennan, Patrick J.
(OAO Corp. Greenbelt, MD., United States)
Date Acquired
September 6, 2013
Publication Date
January 1, 1995
Publication Information
Publication: NASA. Lewis Research Center, The Sixth Annual Thermal and Fluids Analysis Workshop
Subject Category
Fluid Mechanics And Heat Transfer
Accession Number
95N27349
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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