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Crack Development in Cross-Ply Laminates Under Uniaxial TensionThis study addresses matrix-dominated failures in carbon fiber/polymer matrix composite laminates in a cross-ply lay-up. The events of interest are interlaminar fracture in the form of transverse cracks in the 90' plies and longitudinal splitting in the 0 deg plies and interlaminar fracture in the form of 0/90 delamination. These events were observed using various nondestructive evaluation (NDE) techniques during static tensile tests. Acoustic emission (AE) x radiography, and edge view microscopy were the principal ones utilized in a real-time environment. A comparison of the NDE results with an analytical model based on the classical linear fracture mechanics concept of strain energy release rate as a criterion for crack growth was performed. The virtual crack closure theory was incorporated with a finite element model to generate strain energy release rate curves for the analytical case. Celion carbon fiber/polyimide matrix (G30-500/PMR-15) was the material tested with cross-ply lay-ups of (0(2)/90(6))s and (0(4)/90(4))s. The test specimens contained thermally induced cracks caused by the high-temperature processing. The analytical model was updated to compensate for the initial damage and to study further accumulation by taking into account the crack interactions. By correlating the experimental and analytical data, the critical energy release rates were found for the observable events of interest.
Document ID
19960015867
Acquisition Source
Legacy CDMS
Document Type
Thesis/Dissertation
Authors
Gyekenyesi, Andrew L.
(Cleveland State Univ. OH United States)
Date Acquired
September 6, 2013
Publication Date
January 1, 1996
Subject Category
Structural Mechanics
Report/Patent Number
NASA-CR-195464
NAS 1.26:195464
E-9635
Report Number: NASA-CR-195464
Report Number: NAS 1.26:195464
Report Number: E-9635
Accession Number
96N21646
Funding Number(s)
PROJECT: RTOP 505-62-2B
CONTRACT_GRANT: NAG3-1543
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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