Apparatus and method for cold welding thin wafers to hard substrates

An apparatus for coating and bonding parts in a vacuum that includes a floating mount assembly holding one part and applying a bonding load to the parts is discussed. A pivoting mount assembly holds one part and is pivoted between a coating position and a bonding position. At least one coating source is provided for depositing a thin film of a metal onto a surface of each of the parts to improve the cold weld between the two parts. A restraining lever controls the application of the bonding load to the parts. The coating and bonding process occurs in a vacuum chamber with a single set-up.