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The study of flow pattern and phase-change problem in die casting processThe flow pattern and solidification phenomena in die casting process have been investigated in the first phase study. The flow pattern in filling process is predicted by using a VOF (volume of fluid) method. A good agreement with experimental observation is obtained for filling the water into a die cavity with different gate geometry and with an obstacle in the cavity. An enthalpy method has been applied to solve the solidification problem. By treating the latent heat implicitly into the enthalpy instead of explicitly into the source term, the CPU time can be reduced at least 20 times. The effect of material properties on solidification fronts is tested. It concludes that the dependence of properties on temperature is significant. The influence of the natural convection over the diffusion has also been studied. The result shows that the liquid metal solidification phenomena is diffusion dominant, and the natural convection can affect the shape of the interface. In the second phase study, the filling and solidification processes will be considered simultaneously.
Document ID
19960027027
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Wang, T. S.
(NASA Huntsville, AL United States)
Wei, H.
(Engineering Sciences, Inc. Huntsville, AL United States)
Chen, Y. S.
(Engineering Sciences, Inc. Huntsville, AL United States)
Shang, H. M.
(Engineering Sciences, Inc. Huntsville, AL United States)
Date Acquired
September 6, 2013
Publication Date
June 20, 1996
Subject Category
Engineering (General)
Report/Patent Number
AIAA Paper 96-1806
NAS 1.26:201459
NASA-CR-201459
Report Number: AIAA Paper 96-1806
Report Number: NAS 1.26:201459
Report Number: NASA-CR-201459
Meeting Information
Meeting: Thermophysics Conference
Location: New Orleans, LA
Country: United States
Start Date: June 17, 1996
End Date: June 20, 1996
Sponsors: American Inst. of Aeronautics and Astronautics
Accession Number
96N28526
Funding Number(s)
CONTRACT_GRANT: NAS8-40561
Distribution Limits
Public
Copyright
Public Use Permitted.
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