C-Coupon Studies of SiC/SiC Composites: Microstructual Characterization - Part 2

A 'C-coupon' was used to measure the interlaminar tensile behavior of five different composite materials: Sylramic/MI (melt infiltration SiC matrix), ZMl/MI, Sylramic/S300, and ZMI and Hi-Nicalon with an S200 matrix at room temperature, 816 C, and 1204 C. Fracture behavior was characterized by field emission scanning electron microscopy, and observed cracking compared with events measured by modal acoustic emission. Both radial and matrix hoop cracking along the inner radius arising from hoop stresses were observed for all material types. In those composites in which the radial cracks were sufficiently wide to view the composite interior, fracture was observed to occur at the fiber BN or BN matrix interface.