High Density Packaging of Non-Volatile Memory

We describe an innovation in three-dimensional (3D) packaging is heterogeneous stacks containing all of the components for a complete system or subsystem. The stack is constructed using known good die (KGD), and provides a high level of integration and interconnectivity. This packaging technology lends itself to mass storage, as well as complete computers and other complex systems. For non-volatile memory, very high densities can be achieved even through the individual chips themselves are relatively low capacity.