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Flexible CircuitsAdflex Solutions, Inc.'s flexible circuits may be molded to the shape of a chassis for bulk reduction. Particularly valuable when circuitry must be moved. They are produced by combining a plastic film, a metallic conductor and an adhesive. One adhesive, LARC-TPI, developed by the Langley Research Center, is a thermoplastic polyimide resin used to produce laminates by Rogers Corporation. It can be processed at a lower temperature, has good moisture resistance and excellent adherence. It is used to bond film to copper foil conductor materials in flexible circuits. The circuits have both aerospace and commercial applications.
Document ID
20020090949
Acquisition Source
Langley Research Center
Document Type
Other
Date Acquired
August 20, 2013
Publication Date
January 1, 1986
Publication Information
Publication: Spinoff 1986
Subject Category
Electronics And Electrical Engineering
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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