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Diamond LED Utilizing Free Exciton Recombination EmissionDiamond free exciton (FE) recombination emission located around 235 nanometers in wavelength is expected to be highly efficient and a good candidate for deep UV LED. We previously reported that an external efficiency (eta (sub ext)) of 8 x 10-5 was obtained at room temperature from a pn junction sample composed of a S-doped CVD layer and a B-doped synthesized substrate. But a peak intensity ratio of band-A to that of FE emission (rA/FE) was about 100. This undesired behavior seemed to be caused by lattice defects on the mechanically polished p-type substrate. In order to improve LED characteristics, a B-doped layer was grown on a B-doped substrate by MW-assisted CVD method at the following conditions; C/H atomic ratio 0.05%, B/C atomic ratio 50 ppm, temperature 875 C and thickness 0.8 microns. Atomic force microscope analysis showed that the averaged roughness (Ra) of the surface was reduced from 0.48 nm to 0.32 nm. Then S-doped CVD layer growth and device separation by reactive ion etching were done the same way as previous sample. A typical r(sub A/FE) of thus fabricated LED's was greatly suppressed to 0.5, which suggested a defect concentration reduction at the junction. Maximum eta (sub ext) of 2.7 x 10-4 and maximum output power of FE emission of 17 micro Watts was obtained.
Document ID
20030068609
Acquisition Source
Glenn Research Center
Document Type
Abstract
Authors
Yuichiro Okajima
(Tokyo Gas Co. Ltd. Japan)
Takuhiro Ide
(Tokyo Gas Co. Ltd. Japan)
Aki Kawamura
(Tokyo Gas Co. Ltd. Japan)
Takefumi Ishikura
(Tokyo Gas Co. Ltd. Japan)
Kenji Horiuchi
(Tokyo Gas Co. Ltd. Japan)
Date Acquired
August 21, 2013
Publication Date
August 1, 2003
Publication Information
Publication: Proceedings of the Seventh Applied Diamond Conference/Third Frontier Carbon Technology Joint Conference
Publisher: National Aeronautics and Space Administration
Subject Category
Electronics and Electrical Engineering
Report/Patent Number
NASA/CP-2003-212319
Meeting Information
Meeting: 7th Applied Diamond Conference (ADC)
Location: Tsukuba
Country: JP
Start Date: August 18, 2003
End Date: August 21, 2003
Sponsors: Nippon Institute of Technology, National Institute of Advanced Industrial Science and Technology, Glenn Research Center
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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