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Fabrication of Very-High-Aspect-Ratio Microchannels in CVD Diamond by a Molding TechniqueThe growth of diamond films with built-in microchannels (through holes) of a few microns in diameter with aspect ratio up to 50 has been realized using a molding technique and a special template. The method employs the microwave plasma assisted diamond deposition on (III) Si substrate with regular Si whiskers followed by separation of diamond from the substrate to obtain replica of the original pattern. The holes are hexagonal in cross section, and the hole "diameter" is almost constant over the whole depth (ca. 100 μm) The position, diameter and depth of the microchannels can be varied in a broad range. Possible applications of perforated diamond film include membranes, drawing dies, heat spreaders with interconnections for electronic circuits, and novel types of diamond-based composites.
Document ID
20030068614
Acquisition Source
Glenn Research Center
Document Type
Conference Paper
Authors
V G Ralchenko
(General Physics Institute)
E I Givargizov
(Institute of Crystallography Moscow, Russian Federation)
Date Acquired
August 21, 2013
Publication Date
August 1, 2003
Publication Information
Publication: Proceedings of the Seventh Applied Diamond Conference/Third Frontier Carbon Technology Joint Conference
Publisher: National Aeronautics and Space Administration
Subject Category
Solid-State Physics
Report/Patent Number
NASA/CP-2003-212319
Meeting Information
Meeting: 7th Applied Diamond Conference (ADC)
Location: Tsukuba
Country: JP
Start Date: August 18, 2003
End Date: August 21, 2003
Sponsors: Nippon Institute of Technology, National Institute of Advanced Industrial Science and Technology, Glenn Research Center
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Keywords
CVD diamond
silicon whiskers
molding technique
microchannels
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