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Mechanical Properties of ta-C Films Deposited on Polyethylene and Metallic SubstratesResearch in the area of advanced materials application in artificial prosthetics with a view to minimize the biochemical and mechanical complications of implanted materials is carried out. In this paper the results of physical chemical characterization, mechanical properties (nano-hardness, elastic modulus) and tribological testes of ta-C films deposited on ultra high molecular weight polyethylene (UHMWPE) and metallic substrates (Ti, Co-Cr- Mo, stainless steel 138F, hard alloy) are presented. These films were obtained by pulsed arc plasma method (physical vapour deposition, PVD) using a carbon source accelerator in a vacuum of 2 x 10(exp -4) Pa. Physical chemical characterization of ta-C films had been carried out by different methods. The nano-hardness and elastic modulus of ta-C films (approximately 250 nanometers) deposited on the metallic and UHMWPE substrates were measured by nanoindentation method. It was determined that the nano-hardness and elastic modulus are larger for ta-C deposited on the metallic substrates than that deposited on UHMWPE. Wear resistance and the coefficient of friction of ta-C film were measured by different methods.
Document ID
20030068660
Acquisition Source
Glenn Research Center
Document Type
Abstract
Authors
Carlos J M Siqueira
(Parana Federal University Curitiba, Brazil)
Wanderley Veiga
(Parana Federal University Curitiba, Brazil)
Vladimir P Poliakov
(Parana Federal University Curitiba, Brazil)
Ivo A Huemmelgen
(Parana Federal University Curitiba, Brazil)
Gregory G Kirpilenko
(Patinor Coatings Ltd. Zelenograd, Russia)
Date Acquired
August 21, 2013
Publication Date
August 1, 2003
Publication Information
Publication: Proceedings of the Seventh Applied Diamond Conference/Third Frontier Carbon Technology Joint Conference
Publisher: National Aeronautics and Space Administration
Subject Category
Structural Mechanics
Report/Patent Number
NASA/CP-2003-212319
Meeting Information
Meeting: 7th Applied Diamond Conference (ADC)
Location: Tsukuba
Country: JP
Start Date: August 18, 2003
End Date: August 21, 2003
Sponsors: Nippon Institute of Technology, National Institute of Advanced Industrial Science and Technology, Glenn Research Center
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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