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Matrix Cracking in Four Different 2D SiC/SiC Composite SystemsSilicon carbide fiber reinforced, silicon carbide matrix composites are some of the most advanced composite systems for high-temperature, high-stress applications in oxidizing environments. A basic area that needs to be understood for the purpose of material behavior modeling and optimization is the architectural, constituent, and mechanistic factors that contribute to non-linear stress-strain behavior. The mechanism that causes non-linear stress-strain in dense-matrix composites is the formation and propagation of bridged matrix cracks. In addition, the occurrence and propagation of matrix cracks controls the time-dependent strength-properties of these materials in oxidizing environments at elevated temperatures. A modal acoustic emission technique has been used to monitor and estimate the stress-dependent matrix cracking. Two different SiC matrix systems, chemical vapor infiltrated (CVI) and melt-infiltrated (MI), with two different SiC fiber reinforcement, Hi-Nicalon (trademark) and Sylramic (trademark) were compared. Even though the averages of the range where matrix cracking occurred for the composites varied by more than 0.1% in strain and almost 200 MPa in stress, the range or distribution for matrix cracking could be reduced to a narrow band of stress for CVI SiC and MI SiC composites if it were assumed that all matrix cracks emanate outside of the load-bearing fiber, interphase, CVI preform minicomposite. A simple relationship was determined to describe stress-dependent matrix cracking which can then be used to estimate the onset of large, bridged matrix cracks or for material behavior models.
Document ID
20040031565
Acquisition Source
Glenn Research Center
Document Type
Preprint (Draft being sent to journal)
Authors
Morscher, Gregory N.
(Ohio Aerospace Inst. Brook Park, OH, United States)
Date Acquired
September 7, 2013
Publication Date
January 1, 2003
Subject Category
Composite Materials
Meeting Information
Meeting: 35th International SAMPE Technical Conference
Location: Dayton, OH
Country: United States
Start Date: September 28, 2003
End Date: October 2, 2003
Sponsors: Society for the Advancement of Materials and Process Engineering
Funding Number(s)
OTHER: 714-04-22
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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