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Silicon Carbide Diodes Characterization at High Temperature and Comparison With Silicon DevicesCommercially available silicon carbide (SiC) Schottky diodes from different manufacturers rated at 200, 300, 600, and 1200 V, were electrically tested and characterized as a function of temperature up to 300 C. Electrical tests included both steady state and dynamic tests. Steady state tests produced forward and reverse I-V characteristic curves. Transient tests evaluated the switching performance of the diodes in either a hard-switched DC to DC buck converter or a half-bridge boost converter. For evaluation and comparison purposes, the same tests were performed with current state-of-the-art ultra fast silicon (Si) pn-junction diodes of similar ratings and also a Si Schottky diode. The comparisons made were forward voltage drop at rated current, reverse current at rated voltage, and turn-off peak reverse recovery current and reverse recovery time. In addition, efficiency measurements were taken for the buck DC to DC converter using both the SiC Schottky diodes and the Si pn-junction diodes at different temperatures and frequencies. The test results showed that at high temperature, the forward voltage drop for SiC Schottky diodes is higher than the forward drop of the ultra fast Si pn-junction diodes. As the temperature increased, the forward voltage drop of the SiC Schottky increased while for the ultra fast Si pn-junction diodes, the forward voltage drop decreased as temperature increased. For the elevated temperature steady state reverse voltage tests, the SiC Schottky diodes showed low leakage current at their rated voltage. Likewise, for the transient tests, the SiC Schottky diodes displayed low reverse recovery currents over the range of temperatures tested. Conversely, the Si pn-junction diodes showed increasing peak reverse current values and reverse recovery times with increasing temperature. Efficiency measurements in the DC to DC buck converter showed the advantage of the SiC Schottky diodes over the ultra fast Si pn-junction diodes, especially at the higher temperatures and higher frequencies.
Document ID
20040182230
Acquisition Source
Glenn Research Center
Document Type
Preprint (Draft being sent to journal)
Authors
Lebron-Velilla, Ramon C.
(NASA Glenn Research Center Cleveland, OH, United States)
Schwarze, Gene E.
(NASA Glenn Research Center Cleveland, OH, United States)
Gardner, Brent G.
(NASA Glenn Research Center Cleveland, OH, United States)
Adams, Jerry D., Jr.
(North Carolina Agricultural and Technical State Univ. Greensboro, NC, United States)
Date Acquired
September 7, 2013
Publication Date
October 1, 2004
Subject Category
Electronics And Electrical Engineering
Report/Patent Number
E-14806
AIAA Paper 2004-5750
NASA/TM-2004-213336
Report Number: E-14806
Report Number: AIAA Paper 2004-5750
Report Number: NASA/TM-2004-213336
Meeting Information
Meeting: Second International Energy Conversion Engineering Conference
Location: Providence, RI
Country: United States
Start Date: August 16, 2004
End Date: August 19, 2004
Sponsors: American Inst. of Aeronautics and Astronautics
Funding Number(s)
WBS: WBS 22-319-20-N1
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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