Qualifying a Bonding Process for the Space Interferometry Mission

The Space Interferometry Mission consists of three parallel Michelson interferometers that will be capable of detecting extrasolar planets with a high degree of accuracy and precision. High levels of stability must be met in order to fulfill the scientific requirements of this mission. To attain successful measurements the coefficient of thermal expansion between optics and bonding material must be minimized without jeopardizing the integrity of the bonds. Optic-to-optic bonds have been analyzed to better understand variables such as the effects of the coefficient of thermal expansion differences between optics and bonding materials, and materials have been chosen for the project based on these analyses. A study was conducted to determine if a reliable, repeatable process for bonding by wicking adhesive could be obtained using a low-viscosity epoxy and ultra-low expansion glass. A process of creating a methodology of bonding fused silica optics with Z-6020 silane primer and Epo-Tek 301 epoxy will be discussed.