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Lead free and lead reliability for advanced electronic assemblies
Document ID
20060028510
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
hdl:2014/6266
Authors
Ghaffarian, R.
Date Acquired
August 23, 2013
Publication Date
February 10, 2003
Distribution Limits
Public
Copyright
Other
Keywords
lead free Pb free solder joint reliability thermal cycle board reliability ball
grid array chip scale package BGA CSP

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