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2003 high density microelectronics packaging roadmap for space applicationsThis roadmap introduces current technologies, related strategic issues, and research reccomendations for space applications.
Document ID
20060031002
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
hdl:2014/12095
Authors
Galbraith, L.
Date Acquired
August 23, 2013
Publication Date
June 10, 2002
Distribution Limits
Public
Copyright
Other
Keywords
roadmap packaging materials components predictions microelectronics

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