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High density microelectronics packaging roadmap for space applicationsThis roadmap introduces current technologies in use, related strategic issues and trends, and research recommendations for space applications.
Document ID
20060031038
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
hdl:2014/12141
Authors
Galbraith, L.
Date Acquired
August 23, 2013
Publication Date
February 13, 2001
Subject Category
Electronics And Electrical Engineering
Distribution Limits
Public
Copyright
Other
Keywords
microelectronic packaging forecasting

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