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Update on JPL-led CSP/SIP activities (chip scale package/systems-in-a-package)
Document ID
20060031491
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
hdl:2014/12765
Authors
Ghaffarian, R.
Date Acquired
August 23, 2013
Publication Date
May 15, 2001
Distribution Limits
Public
Copyright
Other
Keywords
chipscale package solder joint reliability area array package

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