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CSP Assembly Reliability and Effects of Underfill and Double-Sided PopulationThe JPL-led MicrotypeBGA Consortium of enterprises representing government agencies and private companies have jointed together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.
Document ID
20060032253
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
hdl:2014/13748
Authors
Ghaffarian, R.
Kim, N.
Date Acquired
August 23, 2013
Publication Date
May 21, 2000
Distribution Limits
Public
Copyright
Other
Keywords
chip scale package CSP solder joint reliability underfill double-sided assembly

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