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Challenges in Interconnection and Packaging of Microelectromechanical Systems (MEMS)Integrated circuit packaging and their testing is well advanced because of the maturity of the IC industry, their wide applications, and availability of industrial infrastructure.
Document ID
20060032340
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
hdl:2014/13868
Authors
Rameshan, R.
Ghaffarian, R.
Date Acquired
August 23, 2013
Publication Date
May 22, 2000
Distribution Limits
Public
Copyright
Other
Keywords
COTS MEMS packaging interconnections reliability

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