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Reliability Challenges in Emerging IC Metallization TechnologiesSubmicron metallization has been a mixed blessing.
Document ID
20060032488
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
hdl:2014/14091
Authors
Lloyd, J.
Date Acquired
August 23, 2013
Publication Date
March 20, 2000
Distribution Limits
Public
Copyright
Other
Keywords
Copper Metallization Electromigration

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