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CSP Assembly ReliabilityReviews the many factors that affect interconnect reliability of emerging chip scale package (CSP) assemblies. These include: package type, package build, board design, and assembly variables.
Document ID
20060034136
Acquisition Source
Jet Propulsion Laboratory
Document Type
Reprint (Version printed in journal)
External Source(s)
hdl:2014/17806
Authors
Ghaffarian, R.
Date Acquired
August 23, 2013
Publication Date
July 1, 1999
Publication Information
Publication: Area Array Interconnection Handbook
Distribution Limits
Public
Copyright
Other
Keywords
chip scale package CSP solder joint reliability thermal cycle

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