NASA Logo

NTRS

NTRS - NASA Technical Reports Server

Collections About News Help Login

Press Enter or click the Search button to begin your search.

Back to Results
Design for Testability in 3-Dimensional Assemblies3DANN, a 3D mixed-mode multiple IC stacked processor capable of 1 TeraOPS, presented many novel problems related to testability.
Document ID
20060034378
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
hdl:2014/18334
Authors
Villalpando, C.
Lung, G.
Date Acquired
August 23, 2013
Publication Date
October 20, 1999
Distribution Limits
Public
Copyright
Other
Keywords
3D stacking design for test

Available Downloads

There are no available downloads for this record.

Related Records

There are no records associated with this record.
No Preview Available