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Impact of CSP Assembly Underfill on ReliabilityThis paper reviews the package trend towards miniature scale package (CSP).
Document ID
20060034525
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
hdl:2014/18750
Authors
Ghaffarian, R.
Date Acquired
August 23, 2013
Publication Date
March 14, 2000
Distribution Limits
Public
Copyright
Other
Keywords
chip scale package underfill solderjoint reliability CSP

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