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Update on CSP Assembly Reliability and JPL-led Microtype BGA ConsortiumThis paper will compare three different CSP concepts as well as their assembly reliability.
Document ID
20060034589
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
hdl:2014/18956
Authors
Ghaffarian, R.
Date Acquired
August 23, 2013
Publication Date
February 12, 1998
Distribution Limits
Public
Copyright
Other
Keywords
Chip Scale Packages CSP Coffin-Manson Microtype BGA consortium

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