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BGAs for High Reliability ApplicationsBall Grid Array (BGA) is an important technology for utilizing higher pin counts, without the attendant handling and processing problems of the peripheral leaded packages. They are also robust in processing because of their higher pitch (0.050 inches typical), better lead rigidity, and self-alignment characteristics during reflow processing.
Document ID
20060034610
Acquisition Source
Jet Propulsion Laboratory
Document Type
Reprint (Version printed in journal)
External Source(s)
hdl:2014/19061
Authors
Ghaffarian, R.
Date Acquired
August 23, 2013
Publication Date
March 1, 1998
Publication Information
Publication: Electronic Packaging & Production
Subject Category
Electronics And Electrical Engineering
Distribution Limits
Public
Copyright
Other
Keywords
Ball Grid Array (BGA) lead regidity reflow processing

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