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A Review of Chip Scale and Ball Grid Array Assembly Reliability
Document ID
20060034694
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
hdl:2014/19403
Authors
Ghaffarian, R.
Date Acquired
August 23, 2013
Publication Date
September 20, 1998
Distribution Limits
Public
Copyright
Other
Keywords
advanced surface mount package assembly reliability surface mount Ball Grid
Arrays (BGAs) Chip Scale Packages

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