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Test Strategies for NASAs 3-D Stack Multichip Module Space Flight ComputerAdvanced packaging technologies such as 3D chip stacking, multichip modules (MCMs), and 3D stacks of MCMs provide opportunities for significant reductions in system mass, volume and power.
Document ID
20060034830
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
hdl:2014/20515
Authors
Sasidhar, K.
Alkalai, L.
Chatterjee, A.
Date Acquired
August 23, 2013
Publication Date
July 9, 1998
Distribution Limits
Public
Copyright
Other
Keywords
Test Strategies Space Flight Computer 3D chip stacking multichip modules (MCMs)

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