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CSPs Assembly ReliabilityAvailability of board solder joint reliability information is critical to the wider implementation of Chip Scale Packages (CSPs).
Document ID
20060035602
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
hdl:2014/22683
Authors
Ghaffarian, R.
Date Acquired
August 23, 2013
Publication Date
November 1, 1997
Distribution Limits
Public
Copyright
Other
Keywords
Reliability
Chip Scale Packages CSPs Assembly Reliability Literature Data CSP Assembly

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