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Qualification of Ball Grid Array Assemblies for Space Flight ApplicationsNone given. From Background section: JPL, in partnership with an industrial consortium, is engaged in the investigation of reliability and quality issues of ball grid array (BGA) packages for space flight electronics applications.
Document ID
20060036633
Acquisition Source
Jet Propulsion Laboratory
Document Type
Preprint (Draft being sent to journal)
External Source(s)
hdl:2014/27395
Authors
Bonner, K.
Walton, S.
Date Acquired
August 23, 2013
Publication Date
February 9, 1997
Distribution Limits
Public
Copyright
Other
Keywords
BGA ball grid arrays

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