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A High Frequency Electronic Packaging Technology
Document ID
20060038383
Acquisition Source
Jet Propulsion Laboratory
Document Type
Preprint (Draft being sent to journal)
External Source(s)
Authors
Herman, M.
Lowry, L.
Lee, K.
Kolawa, E.
Tulintseff, A.
Whitaker, S. Senturia J.
Piket-May, M.
Shalkhauser, K.
Date Acquired
August 23, 2013
Publication Date
November 1, 1994
Subject Category
Electronics And Electrical Engineering
Distribution Limits
Public
Copyright
Other
Keywords
digital and analog circuits high frequency packaging RF performance package
material systems

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