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Multichip MMIC Package for X and Ka-bands
This package provides space for mounting up to five MMIC chips and has three RF and five DC feed-throughs.
Document ID
20060038488
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
hdl:2014/34470
Authors
Decker, D.
Olson, H.
Tatikola, R.
Neuman, S.
Gutierrez, R.
Mysoor, N.
Date Acquired
August 23, 2013
Publication Date
May 22, 1994
Distribution Limits
Public
Copyright
Other
Keywords
Multichip MMIC package RF feed-throughs conductor backed coplanar waveguide
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