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The Properties of CrN/Au and Cr/CrN/Au MultilayersGold has been used as a conductor material in many microelectronic applications because of its low resistivity, bondability, and oxidation/corrosion resistance.
Document ID
20060039612
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
hdl:2014/36474
Authors
Kolawa, E.
Lie, D.
Reid, J.
Tai, B.
Lowry, L.
Scott-Monck, J.
Date Acquired
August 23, 2013
Publication Date
April 25, 1994
Distribution Limits
Public
Copyright
Other
Keywords
adhesion of gold diffusion barrier performance of reactively mechanical stress
of individual films peel tests

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