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Assessment of Strengths & Weaknesses for Major IC Packages
Document ID
20060041629
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
hdl:2014/20716
Authors
Ghaffarian, R.
Date Acquired
August 23, 2013
Publication Date
February 8, 1999
Distribution Limits
Public
Copyright
Other
Keywords
BGA CSP Ball Grid Array Chip Scale Package Reliability Thermal Cycles SMT

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