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Vibration behavior of CSP assemblies with and without underfillThis paper presents vibration behavior of these assemblies along with optical and SEM cross-sectional micrographs taken after failures.
Document ID
20060043289
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
hdl:2014/38118
Authors
Ghaffarian, Reza
Date Acquired
August 23, 2013
Publication Date
September 1, 2003
Meeting Information
Meeting: SMTA (Sufrace Mount Technology Association)
Location: Chicago, IL
Country: United States
Start Date: September 22, 2003
End Date: September 26, 2003
Distribution Limits
Public
Copyright
Other
Keywords
thermal cycle
CSP
TSOP
random vibration
MicroBGA
solder joint reliability
underfill

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