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Package qualification and reliability for extreme environment
Document ID
20060044288
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
hdl:2014/39492
Authors
Ghaffarian, Reza
Date Acquired
August 23, 2013
Publication Date
February 22, 2005
Meeting Information
Meeting: International Microelectronics and Packaging Society, Extreme Environment Workshop
Location: Austin, TX
Country: United States
Start Date: February 22, 2005
End Date: February 24, 2005
Distribution Limits
Public
Copyright
Other
Keywords
IPC specifications
extreme cold
solder joint
thermal cycles

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