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Comparison of GRCop-84 to Other High Thermal Conductive Cu AlloysThe mechanical properties of five copper alloys (GRCop-84, AMZIRC, GlidCop Al-15, Cu-1Cr-0.1Zr, Cu-0.9Cr) competing in high temperature, high heat flux applications such as rocket nozzles, were compared. Tensile, creep, thermal expansion, and compression tests are presented. Tests were done on as-received material, and on material which received a simulated brazing heat treatment at 935 C. The 935 C heat treatment weakened AMZIRC, Cu-1Cr-0.1Zr, and Cu-0.9Cr, and the strength of as-received AMZIRC dropped precipitously as test temperatures exceeded 500 C. The properties of GlidCop Al-15 and GRCop-84 were not significantly affected by the 935 C heat treatment. Thus GRCop-84 is better than AMZIRC, Cu-1Cr-0.1Zr, and Cu-0.9Cr at temperatures greater than 500 C. Ductility was lowest in GlidCop Al-15 and Cu-0.9Cr. The creep properties of GRCop-84 were superior to those of brazed AMZIRC, Cu-1Cr-0.1Zr, and Cu-0.9Cr. At equivalent rupture life and stress, GRCop-84 had a 150 C temperature advantage over brazed AMZIRC; for equivalent rupture life and temperature GRCop-84 was two times stronger. The advantages of GRCop-84 over GlidCop Al-15 associated with ease of processing were confirmed by GlidCop s marginal ductility. In the post brazed condition, GRCop-84 was found to be superior to the other alloys due to its greater strength and creep resistance (compared to AMZIRC, Cu-1Cr-0.1Zr, and Cu-0.9Cr) and ductility (compared to GlidCop Al-15)
Document ID
20070017311
Acquisition Source
Glenn Research Center
Document Type
Technical Memorandum (TM)
Authors
deGroh, Henry C., III
(NASA Glenn Research Center Cleveland, OH, United States)
Ellis, David L.
(NASA Glenn Research Center Cleveland, OH, United States)
Loewenthal, William S.
(Ohio Aerospace Inst. Brook Park, OH, United States)
Date Acquired
August 23, 2013
Publication Date
February 1, 2007
Subject Category
Spacecraft Propulsion And Power
Report/Patent Number
NASA/TM-2007-214663
E-15798
Funding Number(s)
WBS: WBS 599489.02.07.03.02.04.01
Distribution Limits
Public
Copyright
Public Use Permitted.
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