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Electronic Packaging TechniquesA characteristic of aerospace system design is that equipment size and weight must always be kept to a minimum, even in small components such as electronic packages. The dictates of spacecraft design have spawned a number of high-density packaging techniques, among them methods of connecting circuits in printed wiring boards by processes called stitchbond welding and parallel gap welding. These processes help designers compress more components into less space; they also afford weight savings and lower production costs.
Document ID
20070019713
Document Type
Other
Date Acquired
August 23, 2013
Publication Date
February 1, 1979
Publication Information
Publication: Spinoff 1979
Subject Category
Technology Utilization and Surface Transportation
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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IDRelationTitle20070019711Analytic PrimarySpinoff 1979